K. Shinoda

发表

Progress and perspectives in dry processes for nanoscale feature fabrication: fine pattern transfer and high-aspect-ratio feature formation

K. Yoshikawa, T. Nozaki, Kazuo Takahashi, 2019, Japanese Journal of Applied Physics.

Thermal-cyclic atomic layer etching of cobalt with smooth etched surface by plasma oxidation and organometallization

H. Hamamura, M. Izawa, Hiroyuki Kobayashi, 2022, Applied Physics Letters.

Dry etching of ternary metal carbide TiAlC via surface modification using floating wire-assisted vapor plasma

M. Hori, Thi‐Thuy‐Nga Nguyen, K. Ishikawa, 2022, Scientific Reports.

Progress and perspectives in dry processes for emerging multidisciplinary applications: how can we improve our use of dry processes?

K. Yoshikawa, T. Nozaki, Kazuo Takahashi, 2019, Japanese Journal of Applied Physics.

Progress and perspectives in dry processes for leading-edge manufacturing of devices: toward intelligent processes and virtual product development

K. Yoshikawa, T. Nozaki, Kazuo Takahashi, 2019, Japanese Journal of Applied Physics.

Rapid thermal-cyclic atomic-layer etching of titanium nitride in CHF3/O2 downstream plasma

M. Hori, K. Ishikawa, Nobuya Miyoshi, 2019, Journal of Physics D: Applied Physics.

Atomic layer etching of silicon nitride using infrared annealing for short desorption time of ammonium fluorosilicate

Hiroyuki Kobayashi, Nobuya Miyoshi, Masaru Izawa, 2017 .

Selective atomic-level etching using two heating procedures, infrared irradiation and ion bombardment, for next-generation semiconductor device manufacturing

Kenji Maeda, Masaru Hori, Hiroyuki Kobayashi, 2017 .

Thermal cyclic etching of silicon nitride using formation and desorption of ammonium fluorosilicate

Masaru Hori, Kenji Ishikawa, Masaru Izawa, 2016 .