Sue Teng

THERMAL MODEL OF A COMPONENT PACKAGE FOR SYSTEM LEVEL APPLICATIONS

Tien-Yu Tom Lee, Sue Teng, Mali Mahalingam, 1997 .

Mechanical and Thermal Board Level Reliability Comparison Between Electroless Ni Im. Au and Solder on Pad Surface Finishes for Large Flip Chip BGA Packages

Dong Hyun Kim, Bill Edwards, Sue Teng, 2006 .

Electrical performance assessment of advanced substrate technologies for high speed networking applications

Mohan Nagar, Judy Priest, Li Li, 2009, 2009 59th Electronic Components and Technology Conference.

Comprehensive Assembly and Reliability Study of 0201's for High Reliability Applications for Utilizing both a Pb-Free and Sn/Pb Assembly Process

G. Ramakrishna, Sue Teng, Jie Xue, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Assembly and reliability of advanced packaging technologies in high speed networking applications

Mohan Nagar, Judy Priest, Sue Teng, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Microstructure and thermal fatigue life of BGAs with eutectic Sn-Ag-Cu balls assembled at 210/spl deg/C with eutectic Sn-Pb solder paste

Sue Teng, Z. Mei, Zequn Mei, 2006, 56th Electronic Components and Technology Conference 2006.