Vivek Chidambaram

Development of gold based solder candidates for flip chip assembly

John Hald, Jesper Henri Hattel, Vivek Chidambaram, 2009, Microelectron. Reliab..

Chassis Loads Prediction using Measurements as Input to an Unconstrained Multi-Body Dynamics Model

James C. Tebbe, Manish Shah, Vivek Chidambaram, 2006 .

Active Silicon Interposer for Heterogeneous Integration: System Scaling and Cost Effectiveness

Surya Bhattacharya, Vivek Chidambaram, Jayabalan Jayasanker, 2019, 2019 Electron Devices Technology and Manufacturing Conference (EDTM).

Wafer Level Reliability Characterization of 2.5D IC packages

Surya Bhattacharya, Vivek Chidambaram, Jong Ming Chinq, 2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).

Supplementation of Measured Vehicle Road Loads to Study Vehicle Configuration Changes

Hyung-Joo Hong, Vivek Chidambaram, Prasad Kodali, 2005 .

High-temperature lead-free solder alternatives

John Hald, Jesper Henri Hattel, Vivek Chidambaram, 2011 .

High temperature endurable hermetic sealing material selection and reliability comparison for IR gas sensor module packaging

Vivek Chidambaram, Ding Mian Zhi, Bu Lin, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Titanium-Based Getter Solution for Wafer-Level MEMS Vacuum Packaging

Xie Ling, Vivek Chidambaram, Chen Bangtao, 2012, Journal of Electronic Materials.

Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application

Vivek Chidambaram, Gan Chee Lip, V. Chidambaram, 2014, Journal of Electronic Materials.

High-temperature endurable encapsulation material

Vivek Chidambaram, Daniel Rhee Min Woo, Ho Beng Yeung, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).