Bor Zen Hong

Performance projection and thermal management of high performance VLSI designs

Li-Kong Wang, Howard Hao Chen, Tsorng-Dih Yuan, 2001, 2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443).

Integrated power-thermal management for high performance integrated circuits

Howard Hao Chen, Tsorng-Dih Yuan, Bor Zen Hong, 2000 .

Power cycling and structural integrity approach for assessing reliability performance of electronic packaging

Tsorng-Dih Yuan, Bor Zen Hong, 2001 .

Integrated electro-thermomechanical analysis of nonuniformly chip-powered microelectronic system

Li-Kong Wang, Tsorng-Dih Yuan, Bor Zen Hong, 2002, Microelectron. Reliab..

Integrated flow-thermomechanical and reliability analysis of a low air cooled flip chip-PBGA package

Tsorng-Dih Yuan, Bor Zen Hong, B. Z. Hong, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

On thermal stresses and reliability of a PBGA chip scale package

Lo-Soun Su, Bor Zen Hong, B. Z. Hong, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Finite element modeling of thermal fatigue and damage of solder joints in a ceramic ball grid array package

Bor Zen Hong, B. Z. Hong, 1997 .

Thermal management for high performance integrated circuits with non-uniform chip power considerations

Tsorng-Dih Yuan, Bor Zen Hong, Howard Hao Chen, 2001, Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189).

Ceramic column grid array technology with coated solder columns

Bor Zen Hong, S. Ray, B. Z. Hong, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).