Shigenobu Sekine

Study on high performance and productivity of TSV's with new filling method and alloy for advanced 3D-SiP

Hidenori Murata, Yoshiharu Iwata, Akihiro Tsukada, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Nano-Function materials for TSV technologies

Makoto Nagata, Hiroaki Ikeda, Tatsuya Ooi, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Study on TSV with new filling method and alloy for advanced 3D-SiP

Yoshiharu Iwata, Shigenobu Sekine, Keijiroh Kishi, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).