K. Haesevoets

Copper Rich Cu1-xNix Alloys (0.05 < x < 0.15) Electrodeposited from Acid Sulfate-Based Electrolyte with Benzotriazole Additive for Microbump Metallization for 3D Stacked Integrated Circuits

A. Radisic, P. Vereecken, K. Haesevoets, 2019, Journal of The Electrochemical Society.

Low temperature deposition of 2D WS2 layers from WF6 and H2S precursors: impact of reducing agents.

S. De Gendt, S. Van Elshocht, H. Bender, 2015, Chemical communications.