D. Ishikawa
发表
A. Hiraiwa,
D. Ishikawa,
S. Sakai,
2002,
Digest. International Electron Devices Meeting,.
N. Kobayashi,
A. Kobayashi,
K. Matsushita,
2013,
2013 IEEE International Interconnect Technology Conference - IITC.
G. Ditmer,
N. Kobayashi,
A. Nakano,
2013
.
N. Kobayashi,
A. Nakano,
A. Kobayashi,
2012,
2012 IEEE International Interconnect Technology Conference.
N. Kobayashi,
D. D. Roest,
A. Nakano,
2012
.
B. An,
B. Leyrer,
T. Blank,
2020,
Transactions of The Japan Institute of Electronics Packaging.
Y. Ejiri,
B. An,
B. Leyrer,
2018,
2018 7th Electronic System-Integration Technology Conference (ESTC).
T. Terasaki,
T. Morita,
Y. Yasuda,
2018,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
T. Morita,
Y. Yasuda,
2016,
2016 International Conference on Electronics Packaging (ICEP).
Effect of Manufacturing Process on Micro-Deformation Behavior of Sintered-Silver Die-Attach Material
T. Terasaki,
M. Nishimura,
Tomohisa Suzuki,
2016,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
T. Matsuda,
T. Morita,
2019,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
T. Morita,
Y. Yasuda,
2018,
IEEE Transactions on Device and Materials Reliability.
A. Hiraiwa,
M. Nakazawa,
D. Ishikawa,
2002
.
Y. Ejiri,
H. Nakako,
D. Ishikawa,
2018
.
H. Nakako,
Motohiro Negishi,
D. Ishikawa,
2022,
Journal of The Japan Institute of Electronics Packaging.
B. An,
B. Leyrer,
T. Blank,
2020,
Transactions of The Japan Institute of Electronics Packaging.
Y. Ejiri,
H. Nakako,
Motohiro Negishi,
2017
.
S. Kamiyama,
T. Morooka,
Y. Ohji,
2010
.
T. Scherer,
B. An,
B. Leyrer,
2018,
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).