H. Schroder

GHOST CANCELLING FOR MOBILE TELEVISION

P. Appelhans, H. Schroder, 1995, Proceedings of International Conference on Consumer Electronics.

Perception adaptive temporal TV-noise reduction using contour preserving prefilter techniques

H. Schroder, Klaus Jostschulte, A. Amer, 1998 .

Polymer Optical Interconnects—A Scalable Large-Area Panel Processing Approach

H. Schroder, G. Lang, N. Arndt-Staufenbiel, 2006, IEEE Transactions on Advanced Packaging.

Fibre-array optical interconnection for silicon photonics

H. Schroder, L. Zimmermann, T. Tekin, 2008, 2008 34th European Conference on Optical Communication.

Thin glass based electrical-optical circuit boards (EOCB) using ion-exchange technology for graded-index multimode waveguides

E. Griese, H. Schroder, N. Arndt-Staufenbiel, 2008, 2008 58th Electronic Components and Technology Conference.

Photonic System-in-Package technologies using thin glass substrates

H. Reichl, H. Schroder, L. Brusberg, 2009, 2009 11th Electronics Packaging Technology Conference.

Polymer optical interconnects for PCB

H. Schroder, W. Scheel, F. Ebling, 2001, First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).

Advanced thin glass based photonic PCB integration

H. Schroder, L. Brusberg, N. Arndt-Staufenbiel, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

New generation interconnection technology: printed circuit boards with integrated optical layers

E. Griese, H. Schroder, P. Demmer, 2005, Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005..

Single-mode glass waveguide platform for DWDM chip-to-chip interconnects

H. Schroder, L. Brusberg, M. Queisser, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

“glassPack” — photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules

H. Schroder, L. Brusberg, N. Arndt-Staufenbiel, 2008, 2008 2nd Electronics System-Integration Technology Conference.

g-Pack – a generic testbed package for Silicon photonics devices

H. Schroder, L. Zimmermann, T. Tekin, 2008, 2008 5th IEEE International Conference on Group IV Photonics.

CMOS compatible silicon etched V-grooves integrated with a SOI fiber coupling technique for enhancing fiber-to-chip alignment

J. Marti, H. Schroder, L. Zimmermann, 2009, 2009 6th IEEE International Conference on Group IV Photonics.

Planar glass waveguides for ffigh performance electrical-optical-circuit-boards (EOCB) - the glass-layer-concept

H. Schroder, W. Scheel, M. Cygon, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..