Dongzhi Fu

Systematic investigation on anode etching residue widely generated in manufacturing of low‐temperature polycrystalline‐Si active matrix organic light‐emitting diode

B. Liu, Yunlei Lu, S. Jiang, 2022, Journal of the Society for Information Display.

Warpage and Reliability Simulation of Super-Size Embedded Silicon Fan-out (eSiFO) Package with size 40mm×40mm

Zhiyi Xiao, Shuying Ma, Dongzhi Fu, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Process Development and Failure Analysis of Super-Size Embedded Silicon Fan-out Package

Shuying Ma, Dongzhi Fu, Jiao Wang, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).