Te Wang

Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz via VUV/O3 activation

Yanhong Tian, Y. Wang, Chenxi Wang, 2018, RSC advances.

Communication—Evaporation Driven Micro/Nanofluidic Pumping Device

K. Mawatari, T. Kitamori, Chenxi Wang, 2018 .

Direct bonding of silicon and quartz glass using VUV/O3 activation and a multistep low-temperature annealing process

Yanhong Tian, Chenxi Wang, Jikai Xu, 2018, Applied Surface Science.

Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste

Yanhong Tian, T. Suga, Chenxi Wang, 2020, Journal of Materials Science: Materials in Electronics.

Pressureless low-temperature sintering of plasma activated Ag nanoparticles for high-power device packaging

Yanhong Tian, Hong Wang, Chenxi Wang, 2019 .

Pressureless Low-Temperature Sintering of Silver Nano-Solder Paste Based on Surface Activation

Yanhong Tian, R. An, Chenxi Wang, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).