S. Saito

Behavior of Bonding Strength on Wafer-to-Wafer Cu-Cu Hybrid Bonding

H. Iwamoto, Y. Hagimoto, T. Hirano, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

IR sensitivity enhancement of CMOS Image Sensor with diffractive light trapping pixels

Suguru Saito, Itaru Oshiyama, Hayato Iwamoto, 2017, Scientific Reports.

IR sensitivity enhancement of CMOS Image Sensor with diffractive light trapping pixels

T. Hirano, H. Iwamoto, I. Oshiyama, 2017, Scientific Reports.

Extremely-low-noise CMOS Image Sensor with high saturation capacity

K. Itonaga, Y. Matoba, T. Ezaki, 2011, 2011 International Electron Devices Meeting.

High-definition Visible-SWIR InGaAs Image Sensor using Cu-Cu Bonding of III-V to Silicon Wafer.

H. Iwamoto, H. Minari, N. Fujii, 2019, 2019 IEEE International Electron Devices Meeting (IEDM).