Chung-Yi Tang

Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps

Liann-Be Chang, Ming-Jer Jeng, Cheng-Chen Lin, 2010, Microelectron. Reliab..

Bump and Underfill Effects on Thermal Behaviors of Flip-Chip LED Packages: Measurement and Modeling

Liann-Be Chang, Chia-Yi Yen, Chung-Yi Tang, 2014, IEEE Transactions on Device and Materials Reliability.