T. Lim

Assessment of a Haptic Virtual Assembly System that uses Physics-based Interactions

T. Lim, J.M. Ritchie, J.R. Corney, 2007, 2007 IEEE International Symposium on Assembly and Manufacturing.

The use of non-intrusive user logging to capture engineering rationale, knowledge and intent during the product life cycle

T. Lim, J.M. Ritchie, J.R. Corney, 2008, PICMET '08 - 2008 Portland International Conference on Management of Engineering & Technology.