Fay Hua

发表

The In -Space Soldering Investigation (ISSI): Melting and Solidification Experiments Aboard the International Space Station

R. N. Grugel, L. Cotton, P. Segre, 2006 .

The In-Space Soldering Investigation: Research Conducted on the International Space Station in Support of NASA's Exploration Initiative

G. Funkhouser, F. Parris, D. Gillies, 2004 .

Materials Research Conducted Aboard the International Space Station: Facilities Overview, Operational Procedures, and Experimental Outcomes

Donald C. Gillies, R. Spivey, P. Luz, 2006 .

On-Orbit Testing of Materials and Processes

Donald C. Gillies, Fay Hua, Richard N. Grugel, 2006 .

The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging

Fay Hua, F. Hua, M. Miller, 2006 .

Pb-free solder challenges in electronic packaging and assembly

Fay Hua, F. Hua, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..