E. Monier-Vinard

Delphi style compact modeling by means of genetic algorithms of system in Package devices using composite sub-compact thermal models dedicated to model order reduction

E. Monier-Vinard, V. Bissuel, C. Dia, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Thermal modeling of active embedded chip into high density electronic board

E. Monier-Vinard, V. Bissuel, O. Daniel, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Dynamic Compact Thermal Model for stacked-die components

E. Monier-Vinard, V. Bissuel, O. Daniel, 2012, 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

PCB design flow under thermal control

E. Monier-Vinard, A. Le Gal, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Thermal characterisation of cots electronic boards

E. Monier-Vinard, V. Bissuel, J.M. Deu, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.