T. Ohba
发表
Y. Matsumoto,
H. Kudo,
T. Yonekawa,
2014,
2014 International Conference on Electronics Packaging (ICEP).
Y. Matsumoto,
Y. Oguri,
A. Tsukune,
2013,
2013 IEEE International Electron Devices Meeting.
T. Ohba,
T. Ohba,
N. Misawa,
1994
.
T. Ohba,
T. Ohba,
Y. Mizushima,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
H. Kitada,
T. Ohba,
K. Arai,
2014,
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers.
H. Kitada,
T. Ohba,
T. Eshita,
2010,
2010 Symposium on VLSI Technology.
T. Ohba,
2001,
2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443).
H. Kitada,
T. Ohba,
Y. Mizushima,
2010,
2010 IEEE International Interconnect Technology Conference.
H. Kitada,
T. Ohba,
K. Arai,
2009,
2009 IEEE International Electron Devices Meeting (IEDM).
Y. Sambonsugi,
K. Suzuki,
N. Horiguchi,
2002,
2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303).
Y. Sambonsugi,
K. Suzuki,
N. Horiguchi,
2002,
2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303).
T. Ohba,
K. Arai,
T. Nakamura,
2015,
2015 IEEE International Electron Devices Meeting (IEDM).
T. Suzuki,
H. Kitada,
T. Ohba,
2009,
2009 IEEE International Interconnect Technology Conference.