H.Y. Zhang

Thermal analysis and modeling of diode array integrated with directional liquid-cooled heat sink

H.Y. Zhang, D. Pinjala, P.K. Chan, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

A study on EWMA TBE charts with transformed Weibull data

H.Y. Zhang, T.N. Goh, Y.J. Xie, 2008, 2008 4th IEEE International Conference on Management of Innovation and Technology.

Fluid flow and heat transfer in liquid cooled foam heat sinks for electronic packages

H.Y. Zhang, D. Pinjala, M.K. Iyer, 2005, IEEE Transactions on Components and Packaging Technologies.

Fluid flow and heat transfer characteristics of liquid cooled foam heat sinks

H.Y. Zhang, D. Pinjala, M.K. Iyer, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

Economic design of integrated time-between-events chart system with independent quality characteristics

H.Y. Zhang, M. Shamsuzzaman, M. Xie, 2007, 2007 IEEE International Conference on Industrial Engineering and Engineering Management.

Development of liquid cooling techniques for flip chip ball grid array packages with High Heat flux dissipations

H.Y. Zhang, D. Pinjala, Y.K. Joshi, 2005, IEEE Transactions on Components and Packaging Technologies.

Multi-Level Approach to Thermal Modeling of Electronic Components With Numerous Fine Features

H.Y. Zhang, K.C. Toh, K.S. Tan, 2008, 2008 10th Electronics Packaging Technology Conference.

Air Flow Modeling and Analysis for Thermal Management in Functional Burn-In Systems

H.Y. Zhang, Y.C. Mui, R. Mandal, 2007, 2007 9th Electronics Packaging Technology Conference.