Cheol-Yeong Kim

Interfacial Adhesion Energies of Uniformly Self-Formed Cr2O3 Barriers for Advanced Co Interconnects

Young‐Chang Joo, Gahui Kim, Young-Bae Park, 2022, Electronic Materials Letters.

Interfacial Adhesion Energies of Uniformly Self-Formed Cr2O3 Barriers for Advanced Co Interconnects

Young‐Chang Joo, Gahui Kim, Young-Bae Park, 2022, Electronic Materials Letters.

Robust Co alloy design for Co interconnects using a self-forming barrier layer

Young‐Chang Joo, Gi-Baek Lee, Ji-Yong Kim, 2022, Scientific Reports.