L. Chapelon

发表

Evaluation of a PECVD advanced barrier (k=3.7) for 32nm CMOS technology and below

E. Petitprez, A. Farcy, P. Brun, 2007 .

Characterization and integration of a CVD porous SiOCH (k<2.5) with enhanced mechanical properties for 65 nm CMOS interconnects and below

J. Vitiello, J. Torres, M. Broekaart, 2004 .

UV curing effects on mechanical and electrical performances of a PECVD non-porogen porous SiOC: H films (in k [2.2-2.4] range) for 45nm node and below

D. Barbier, J. Vitiello, J. Torres, 2006 .

Evaluation of ellipsometric porosimetry for in-line characterization of ultra low-κ dielectrics

T. Chevolleau, C. Licitra, F. Bertin, 2008 .

Impact of dielectric stack and interface adhesion on mechanical properties of porous ultra low-k

D. Barbier, J. Vitiello, J. Torres, 2005 .

Sidewall restoration of porous ultra low-k dielectrics for sub-45nm technology nodes

A. Farcy, P. Brun, T. Chevolleau, 2007 .

Effect of CH4 plasma on porous dielectric modification & pore sealing for advanced interconnect technology nodes

Y. Bréchet, A. Farcy, N. Possémé, 2006, 2006 International Interconnect Technology Conference.

An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Pierric Gueguen, Rachid Taibi, Laurent Clavelier, 2011 .

Robust integration of an ULK SiOCH dielectric (k=2.3) for high performance 32nm node BEOL

N. Jourdan, A. Farcy, P. Brun, 2007, 2007 IEEE International Interconnect Technology Conferencee.

Curvature measurements to improve polymer integration in microelectronic devices

R. Estevez, L. Vignoud, L. Chapelon, 2023, Advanced Semiconductor Manufacturing Conference.

(Invited) An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Laurent Clavelier, Didier Landru, Ionut Radu, 2010 .

Use of optical metrology techniques for uniformity Control of 3D stacked IC's

P. Bar, D. Le Cunff, M. Tardif, 2014, 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014).

Full characterization of Cu/Cu direct bonding for 3D integration

Pierric Gueguen, Rachid Taibi, Laurent-Luc Chapelon, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).