Y. H. Chen
发表
G. Sawa,
K. Iida,
Y.H. Chen,
1994,
Proceedings of IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP'94).
R. Tain,
C. Chen,
Liang Chang,
2016,
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
J. Duan,
S. Karim,
Heliang Yao,
2016
.
M. Hou,
J. Duan,
D. Mo,
2014
.
Sanboh Lee,
C. L. Li,
K. Chou,
2011
.
T. Shao,
Chih Chen,
Y. H. Chen,
2004
.
Jinwei Cao,
Yunpeng Wang,
Haitao Ma,
2020
.
J. Duan,
S. Karim,
D. Mo,
2016
.
C. Kao,
Szu-Chi Yang,
H. Hung,
2019,
Scripta Materialia.
C. Kao,
Szu-Chi Yang,
H. Hung,
2016,
2019 International Conference on Electronics Packaging (ICEP).
Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface Finish
H. Hung,
Y. H. Chen,
W. C. Huang,
2020,
Journal of Electronic Materials.
S. Yang,
H. Hung,
Y. H. Chen,
2018,
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).