Yue Li

Effectiveness of thermal redistribution layer in cooling of 3D ICs

Fengjuan Wang, N. Yu, Yuan Yang, 2020, International Journal of Numerical Modelling: Electronic Networks, Devices and Fields.

A highly efficient heat-dissipation system using RDL and TTSV array in 3D IC

Fengjuan Wang, N. Yu, Yue Li, 2019, 2019 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC).

Effect of heat treatment on microstructure evolution, phase transformation and corrosion resistance of Mg-4Zn-0.4Zr-1.0Sr alloy

Ming Li, XiaoPeng Lu, Chunxiang Xu, 2023, International Journal of Electrochemical Science.