Stéphane Elisabeth

发表

M. Richard-Plouet, L. Zajíčková, A. Goullet, 2020, Applied Surface Science.

Stéphane Elisabeth, Stéphane Elisabeth, 2019, 2019 International Wafer Level Packaging Conference (IWLPC).

Stéphane Elisabeth, Santosh Kumar, F. Shoo, 2021, Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces.