J. Ladroue

Parametric study of STiGer etching process in order to reduce extended formation of scalloping defects on the sidewalls of silicon submicron trenches

M. Boufnichel, P. Lefaucheux, P. Ranson, 2016 .

Optimization of submicron deep trench profiles with the STiGer cryoetching process: reduction of defects

M. Boufnichel, P. Lefaucheux, P. Ranson, 2011 .

Study of dc micro-discharge arrays made in silicon using CMOS compatible technology

M. Woytasik, P. Lefaucheux, R. Dussart, 2012 .

Characterisation of Silicon based micro discharge plasma arrays in Direct Current (DC) at atmospheric pressure

P. Lefaucheux, P. Ranson, R. Dussart, 2011 .

Deep GaN etching by inductively coupled plasma and induced surface defects

Remi Dussart, Pierre Ranson, Philippe Lefaucheux, 2010 .

Flexible CMUT for Vibrating Mesh Nebulize

D. Certon, N. Heuzé-Vourc’h, D. Alquier, 2019, IUS.