T. Reinikainen

A novel response surface method for design optimization of electronic packages

Leon Xu, Bo Ping Wang, Zhen Xue Han, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Multi-Physics Simulation Strategies with Application to Fuel Cell Modeling

Leon Xu, Bo Ping Wang, Zhenxue Han, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

A Novel Response Surface Method for Simulation-Based Design Optimizations of

Leon Xu, Bo Ping Wang, Timwah Luk, 2005 .

Cracking Phenomena on Flexible-Rigid Interfaces in PWBs under Thermo Cycling Loading

T. Reinikainen, Luciano Arruda, Renato Bonadiman, 2008, EPTC 2008.

TBGA reliability in telecom environment

Wei Lin, T. Reinikainen, Jiansen Zhu, 2000 .

Application of ABAQUS/Explicit submodeling technique in drop simulation of system assembly

Wei Ren, Jianjun Wang, T. Reinikainen, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

Optimal Parameter Selection for Electronic Packaging Using Sequential Computer Simulations

Yu Ding, Abhishek Gupta, Leon Xu, 2006 .