W. Volksen

The efficacy of post porosity plasma protection against vacuum-ultraviolet damage in porous low-k materials

M. Darnon, T. Magbitang, G. Dubois, 2015 .

Analysis of Plasma-Induced Modification of ULK and eULK Materials: Dual Damascene Processing Challenges for 45nm (K ⩽ 2.4) and Beyond BEOL Technologies

S. Bent, S. Nitta, S. Purushothaman, 2006, 2006 International Interconnect Technology Conference.

Molecular Network Reinforcement of Sol–Gel Glasses

R. Dauskardt, T. Magbitang, R. D. Miller, 2007 .

Polyimide for thin film redistribution on glass-ceramic/copper multilevel substrates (ES9000 system)

R. DiPietro, M. Ree, G. Czornyj, 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

Photochemical Stability and Performance of Second Order Nonlinear Optical Chromophores and Polymers

A. Knoesen, D. Yankelevich, R. D. Miller, 1995, Organic Thin Films for Photonic Applications.

Investigation of plasma etch damage to porous oxycarbosilane ultra low-k dielectric

S. Engelmann, R. Bruce, M. Darnon, 2013 .