M. Shimada

X-ray absorption studies of high performance Low-k dielectric materials

H. Hashimoto, H. Miyajima, T. Yoda, 2002 .

Structural Studies of High-Performance Low-k Dielectric Materials Improved by Electron-Beam Curing

H. Hashimoto, Y. Nakasaki, H. Miyajima, 2005 .

Ta penetration into template-type porous low-k material during atomic layer deposition of TaN

A. Furuya, S. Ogawa, N. Ohtsuka, 2005 .

Ultrathin pore-seal film by plasma enhanced chemical vapor deposition SiCH from tetramethylsilane

A. Furuya, S. Ogawa, N. Ohtsuka, 2005 .

Etch-Byproduct Pore Sealing for Atomic-Layer-Deposited-TaN Deposition on Porous Low-k Film

A. Furuya, S. Ogawa, E. Soda, 2005 .

Self-Formed Barrier Technology using CuMn Alloy Seed for Copper Dual-Damascene Interconnect with porous-SiOC/porous-PAr Hybrid Dielectric

H. Shibata, A. Gawase, M. Shimada, 2007, 2007 IEEE International Interconnect Technology Conferencee.