King Lien Tai
发表
Robert C. Frye,
Maureen Yee Lau,
King Lien Tai,
1993
.
Robert C. Frye,
M. Y. Lau,
King Lien Tai,
1993,
Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93.
King Lien Tai,
A. Lotfi,
Robert C. Frye,
1996,
Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893).
Robert C. Frye,
M. Y. Lau,
King Lien Tai,
1994,
Proceedings of IEEE Multi-Chip Module Conference (MCMC-94).
Jinsong Zhao,
R. C. Frye,
King Lien Tai,
1997,
Proceedings 1997 International Conference on Multichip Modules.
R. C. Frye,
T. J. Gabara,
King Lien Tai,
1997,
Proceedings 1997 IEEE Multi-Chip Module Conference.
T. J. Gabara,
King Lien Tai,
Robert C. Frye,
1993,
Sixth Annual IEEE International ASIC Conference and Exhibit.
Jinsong Zhao,
R. C. Frye,
King Lien Tai,
1997
.
R. C. Frye,
Jenshan Lin,
Young-Kai Chen,
1996
.
Jinsong Zhao,
R. C. Frye,
King Lien Tai,
1997,
Proceedings of CICC 97 - Custom Integrated Circuits Conference.
W. Dai,
Jinsong Zhao,
R. C. Frye,
1997,
Proceedings 1997 IEEE Multi-Chip Module Conference.
R. C. Frye,
T. J. Gabara,
King Lien Tai,
1997
.
Robert C. Frye,
Maureen Y. Lau,
King Lien Tai,
1995
.
A silicon-on-silicon multichip module technology with integrated bipolar components in the substrate
R. C. Frye,
M. Y. Lau,
King Lien Tai,
1994,
Proceedings of IEEE Multi-Chip Module Conference (MCMC-94).
Robert C. Frye,
M. Y. Lau,
King Lien Tai,
1992,
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92.
D. Kossives,
Yicheng Lu,
R. C. Frye,
1995,
Proceedings of Electrical Performance of Electronic Packaging.