Jong-heun Lim

Electrochemical Patterning of Copper Using Microcontact Printing

N. Kim, E. Chang, Jong-heun Lim, 2004 .

Chemical Mechanical Planarization Technology for Si Wafer Bonding

B. Yoon, Jong-heun Lim, Kyung-hyun Kim, 2010 .

Semi-abrasive free slurry with acid colloidal silica for copper chemical mechanical planarization

N. Kim, Sang-Yong Kim, E. Chang, 2005 .

Effects of phosphoric acid stabilizer on copper and tantalum nitride CMP

N. Kim, Sang-Yong Kim, E. Chang, 2003 .

H/sub 3/PO/sub 4/ addition to slurry for Cu and TaN CMP

N. Kim, Sang-Yong Kim, E. Chang, 2003 .