Chih-Yi Huang

Torque and current control of induction motor drives for inverter switching frequency reduction

Chih-Yi Huang, Chao-Peng Wei, Jung-Tai Yu, 2005, IEEE Trans. Ind. Electron..

Optimizing FCCSP design with Cu-pillar bump in high sensitivity fingerprint sensor

Chih-Yi Huang, Chen-Chao Wang, Cheng-Yu Tsai, 2014, IEEE CPMT Symposium Japan 2014.

Ultra High Density Package Design and Electrical Analysis in High Performance Computing Application

Chih-Yi Huang, Ming-Fong Jhong, Chen-Chao Wang, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

A microcomputer-based induction motor drive system using current and torque control

Chih-Yi Huang, Tien-Chi Chen, Ching-Lien Huang, 1999 .

Adaptive Fuzzy Sliding Mode Control Schemes for Tracking Time-various Trajectories

Chih-Yi Huang, Ted Tao, 2007, 2007 IEEE International Fuzzy Systems Conference.

Integrated Antenna-in-Package on Low-Cost Organic Substrate for Millimeter-Wave Wireless Communication Applications

Po-Chih Pan, Chih-Yi Huang, Ming-Fong Jhong, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Design and electrical performance analysis on coreless flip chip BGA substrate

Chih-Yi Huang, Chen-Chao Wang, Cheng-Yu Tsai, 2017, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Utilizing low loss dielectric material for high performance DRAM window-BGA design

Chih-Yi Huang, Chen-Chao Wang, Hung-Hsiang Cheng, 2008, 2008 IEEE-EPEP Electrical Performance of Electronic Packaging.

A novel flow to optimize package power distribution network design

Chih-Yi Huang, Chen-Chao Wang, Cheng-Yu Tsai, 2015, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

The Optimal window-BGA Design for High-Speed SDRAM

Chih-Yi Huang, Tsun-Lung Hsieh, Hung-Hsiang Cheng, 2008, 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.