H. J. L. Bressers

Correlation between chemistry of polymer building blocks and microelectronics reliability

Willem D. van Driel, G. Q. Zhang, Kaspar M. B. Jansen, 2007, Microelectron. Reliab..

Effect of filler concentration of rubbery shear and bulk modulus of molding compounds

G. Q. Zhang, Kaspar M. B. Jansen, Dao-Guo Yang, 2007, Microelectron. Reliab..

Virtual qualification of moisture induced failures of advanced packages [IC packages]

Willem D. van Driel, G. Q. Zhang, H. J. L. Bressers, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Numerical modeling of warpage induced in QFN array molding process

G. Q. Zhang, W. D. van Driel, L. J. Ernst, 2007, Microelectron. Reliab..

Novel shear tools for viscoelastic characterization of packaging polymers

G. Q. Zhang, Kaspar M. B. Jansen, Dao-Guo Yang, 2007, Microelectron. Reliab..

Process-induced WarpageinHVQFN Package: Effect ofDesign Parameters andProcessing Conditions

Kaspar M. B. Jansen, H. J. L. Bressers, Leo J. Ernst, 2005 .

Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

H. J. L. Bressers, Leo J. Ernst, Guoqi Zhang, 2003 .