Song Yuan

发表

Insights into the atomistic behavior in diamond chemical mechanical polishing with OH environment using ReaxFF molecular dynamics simulation

Jiang Guo, Xiaoguang Guo, Zhuji Jin, 2019, Computational Materials Science.

Atomistic mechanisms of chemical mechanical polishing of diamond (1 0 0) in aqueous H2O2/pure H2O: Molecular dynamics simulations using reactive force field (ReaxFF)

R. Kang, Xiaoguang Guo, Zhuji Jin, 2019, Computational Materials Science.

Effect of grinding damage on cutting force and ductile machining during single grain scratching of monocrystalline silicon

D. Guo, Ming Li, Xiaoguang Guo, 2022, Materials Science in Semiconductor Processing.

Insight on the structural changes of Glass-Ceramics during nanoindentation derived from Reactive Force-Field-Based molecular dynamic simulations

Shuohua Zhang, Xiaoguang Guo, Zhuji Jin, 2022, Applied Surface Science.

Atomistic observations on the structure evolution of glass-ceramics induced by the cascade collisions

R. Kang, D. Guo, Shuohua Zhang, 2021 .

Insight into the roles of the glassy phase in glass-ceramics during the cascade collisions

R. Kang, D. Guo, Ming Li, 2021 .

Study on subsurface layer of nano-cutting single crystal tungsten in different crystal orientations

Z. Dong, R. Kang, Wenhao Du, 2020 .

Study on chemical effects of H2O2 and glycine in the Copper CMP process using ReaxFF MD

R. Kang, Jiang Guo, Xiaoguang Guo, 2020, Applied Surface Science.

Sub-nanoscale polishing of single crystal diamond(100) and the chemical behavior of nanoparticles during the polishing process

R. Kang, D. Guo, Xiaoguang Guo, 2019 .

Insights into the surface oxidation modification mechanism of nano-diamond: An atomistic understanding from ReaxFF simulations

R. Kang, D. Guo, Xiaoguang Guo, 2021 .

Effects of pressure and slurry on removal mechanism during the chemical mechanical polishing of quartz glass using ReaxFF MD

R. Kang, D. Guo, Xiaoguang Guo, 2020 .

Effect of surface hydroxylation on ultra-precision machining of quartz glass

R. Kang, D. Guo, Xiaoguang Guo, 2020 .

Effects of grinding speeds on the subsurface damage of single crystal silicon based on molecular dynamics simulations

R. Kang, D. Guo, Ming Li, 2021, Applied Surface Science.

Effects of tool geometry on tungsten removal behavior during nano-cutting

Z. Dong, R. Kang, Yan Bao, 2022, International Journal of Mechanical Sciences.

Study using ReaxFF-MD on the CMP process of fused glass in pure H2O/aqueous H2O2

R. Kang, D. Guo, Xiaoguang Guo, 2021 .

Atomic understanding of the densification removal mechanism during chemical mechanical polishing of fused glass

Xiaoguang Guo, Wei Liu, Song Yuan, 2022, Applied Surface Science.

Influence mechanism of defects on the subsurface damage and structural evolution of diamond in CMP process

R. Kang, D. Guo, Shuohua Zhang, 2021 .

Atomistic understanding of interfacial processing mechanism of silicon in water environment: A ReaxFF molecular dynamics simulation

R. Kang, D. Guo, Ming Li, 2021, Frontiers of Mechanical Engineering.

Effects of pressure and velocity on the interface friction behavior of diamond utilizing ReaxFF simulations

A. V. Duin, Jiang Guo, R. Kang, 2021 .

Insight into the mechanism of low friction and wear during the chemical mechanical polishing process of diamond: A reactive molecular dynamics simulation

R. Kang, D. Guo, Xiaoguang Guo, 2020 .

Diamond nanoscale surface processing and tribochemical wear mechanism

R. Kang, D. Guo, Xiaoguang Guo, 2019, Diamond and Related Materials.

Effects of cutting force on formation of subsurface damage during nano-cutting of single crystal tungsten

Z. Dong, R. Kang, Yan Bao, 2022, Journal of Manufacturing Science and Engineering.

An insight into polishing slurry for high quality and efficiency polishing of diamond

D. Guo, Ming Li, Xiaoguang Guo, 2022, Tribology International.

Study on subsurface damage mechanism of gallium nitride in nano-grinding

Z. Dong, R. Kang, D. Guo, 2021, Materials Science in Semiconductor Processing.

Atomistic understanding of the subsurface damage mechanism of silicon (100) during the secondary nano-scratching processing

R. Kang, Xiaoguang Guo, Lemin Zhang, 2022, Materials Science in Semiconductor Processing.

Atomistic understanding of rough surface on the interfacial friction behavior during the chemical mechanical polishing process of diamond

R. Kang, Shang Gao, Xiaoguang Guo, 2023, Friction.

The deformation mechanism of Gallium-faces and Nitrogen-faces Gallium Nitride during nanogrinding

Z. Dong, R. Kang, D. Guo, 2021, International Journal of Mechanical Sciences.

Effects of initial temperature on the damage of GaN during nanogrinding

Z. Dong, R. Kang, Xiaoguang Guo, 2021 .

Insights into Interfacial Mechanism of CeO2/Silicon and Atomic-Scale Removal Process during Chemo-Mechanical Grinding of Silicon.

Yu Zhang, Song Yuan, Renke Kang, 2023, Langmuir : the ACS journal of surfaces and colloids.

An Analysis of the Effect of Abrasive/Tool Wear on the Ductile Machining of Fused Silica from the Perspective of Stress

D. Guo, Ming Li, Shuohua Zhang, 2022, Micromachines.