Zekun Yang

GRAPHIC: GatheR-And-Process in Highly parallel with In-SSD Compression Architecture in Very Large-Scale Graph

Huazhong Yang, N. Vijaykrishnan, Yongpan Liu, 2022, ArXiv.

Fusing Active and Passive Remotely Sensed Soil Moisture Products Using an Improved Double Instrumental Variable Method

W. Fan, Yaokui Cui, Junliang Fan, 2022, IEEE Transactions on Geoscience and Remote Sensing.

Hidden-ROM: A Compute-in-ROM Architecture to Deploy Large-Scale Neural Networks on Chip with Flexible and Scalable Post-Fabrication Task Transfer Capability

Yongpan Liu, Xueqing Li, Wenjun Tang, 2022, 2022 IEEE/ACM International Conference On Computer Aided Design (ICCAD).

SAMBA: Single-ADC Multi-Bit Accumulation Compute-in-Memory Using Nonlinearity- Compensated Fully Parallel Analog Adder Tree

Yongpan Liu, Xueqing Li, Jinshan Yue, 2023, IEEE Transactions on Circuits and Systems I: Regular Papers.

A 16-Bit 4.0-GS/s Calibration-Free 65nm DAC with >70dBc SFDR and <-80dBc IM3 up to 1GHz Using Constant-Activity Element Switching

Nan Sun, Yang Liu, Yushen Fu, 2021, ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC).

Potential of ANN for Prolonging Remote Sensing-Based Soil Moisture Products for Long-term Time Series Analysis

Yaokui Cui, Xi Chen, Sien Li, 2022, IEEE Geoscience and Remote Sensing Letters.

Cramming More Weight Data Onto Compute-in-Memory Macros for High Task-Level Energy Efficiency Using Custom ROM With 3984-kb/mm2 Density in 65-nm CMOS

Yongpan Liu, Xueqing Li, V. Narayanan, 2024, IEEE Journal of Solid-State Circuits.

YOLoC: deploy large-scale neural network by ROM-based computing-in-memory using residual branch on a chip

Kaisheng Ma, Huazhong Yang, Yongpan Liu, 2022, DAC.