Hongyu Li

发表

Xiaowu Zhang, Roshan Weerasekera, Dim-Lee Kwong, 2015 .

G. Lo, L. Ding, G. Lau, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

Rui Li, Sanming Hu, Liang Ding, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

S. Chong, Hongyu Li, Ling Xie, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

S. Chong, Ling Xie, Qin Ren, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

Chuan Seng Tan, Lan Peng, Shan Gao, 2012, IEEE Transactions on Device and Materials Reliability.

Yong Han, M. Kawano, Hongyu Li, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

Hongyu Li, Dim-Lee Kwong, Chuan Seng Tan, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

M. Kawano, Qin Ren, Hongyu Li, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2007 .