Thomas Schmidt

FUSION BONDING AND INTEGRATED METROLOGY – TECHNOLOGY EXPANSION OF SUSS MICROTEC’S PRODUCT RANGE

Gregory George, T. Gerber, Thomas Schmidt, 2020 .

Infrared heated μ-blistering, a new fabrication technology for HARMST

C. Mueller, H. Reinecke, Thomas Schmidt, 2014, Microsystem Technologies.

Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer

G. Beyer, E. Beyne, Alice Guerrero, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).