J. Chen

Effects of oxidizing agent and hydrodynamic condition on copper dissolution in chemical mechanical polishing electrolytes

W. Tsai, J. Chen, Shiou Ru Lin, 2004 .

Chemical–mechanical polishing behavior of tantalum in slurries containing citric acid and alumina

W. Tsai, J. Chen, 2004 .

Effect of Oxidizer on the Galvanic Behavior of Cu ∕ Ta Coupling during Chemical Mechanical Polishing

Wen-Ta Tsai, W. Tsai, Szu Jung Pan, 2006 .

Effects of hydrogen peroxide and alumina on surface characteristics of copper chemical–mechanical polishing in citric acid slurries

W. Tsai, J. Chen, 2004 .