K. Yess
发表
X. Shao,
X. Zhong,
Gu Xu,
2010
.
X. Zhong,
C. Planje,
K. Yess,
2008
.
Andy Miller,
G. Beyer,
E. Beyne,
2019,
2019 International Wafer Level Packaging Conference (IWLPC).
Andy Miller,
G. Beyer,
E. Beyne,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
A. Jourdain,
G. Beyer,
E. Beyne,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
G. Beyer,
E. Beyne,
E. Sleeckx,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
A. Jourdain,
K. Rebibis,
Andy Miller,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
K. Rebibis,
Andy Miller,
G. Beyer,
2019,
2019 International Wafer Level Packaging Conference (IWLPC).