Tao-Chi Liu

Eliminate Kirkendall voids in solder reactions on nanotwinned copper

K. Tu, Chih Chen, Tao-Chi Liu, 2013 .

Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition

H. Hsiao, Tao-Chi Liu, Chien-min Liu, 2012 .

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

Han-wen Lin, King-Ning Tu, Hsiang-Yao Hsiao, 2012, Science.

Failure analysis for electronic devices on flexible substrate

P. Lo, Pei-Wen Li, Tao-Chi Liu, 2009, 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.

Extremely anisotropic single-crystal growth in nanotwinned copper

K. Tu, Chia-ling Lu, J. Kuo, 2014 .

Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging

K. Tu, Chia-ling Lu, J. Kuo, 2015, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).