J. Evans
发表
T. Sanders,
Z. Hai,
Cong Zhao,
2016
.
J. Suhling,
M. Bozack,
T. Sanders,
2016
.
D. Baldwin,
T. Tessier,
Zhaozhi Li,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
John L. Evans,
T. Sanders,
Jiawei Zhang,
2020,
2020 Pan Pacific Microelectronics Symposium (Pan Pacific).
P. Lall,
J. Suhling,
S. Hamasha,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
J. Suhling,
M. Bozack,
Z. Hai,
2015
.
John L. Evans,
M. Bozack,
F. Megahed,
2016,
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
John L. Evans,
M. Bozack,
G. Flowers,
2016,
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Jeffrey S. Smith,
John L. Evans,
Jorge F. Valenzuela,
2004
.
J. Suhling,
Z. Hai,
Jiawei Zhang,
2015
.
Andrew Mawer,
John L. Evans,
Rickie M. Adams,
1998
.
R. Wayne Johnson,
Nokibul Islam,
Jeffrey C. Suhling,
2002
.
S. Hamasha,
F. Akkara,
Mohammed Abueed,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
M. Bozack,
S. Hamasha,
W. Johnson,
2018,
2018 Pan Pacific Microelectronics Symposium (Pan Pacific).
Pradeep Lall,
Jeffrey C. Suhling,
John L. Evans,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Pradeep Lall,
Nokibul Islam,
Jeffrey C. Suhling,
2007
.
Jeffrey C. Suhling,
John L. Evans,
Zhou Hai,
2017,
Materials.
Pradeep Lall,
R. Wayne Johnson,
Jeffrey C. Suhling,
2004
.
John L. Evans,
J. Suhling,
M. Bozack,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Pradeep Lall,
Jeffrey C. Suhling,
John L. Evans,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Jeffrey C. Suhling,
John L. Evans,
Zhou Hai,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John L. Evans,
S. Hamasha,
Sinan Su,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation
John L. Evans,
Michael J. Bozack,
Wayne R. Johnson,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
David W. Coit,
John L. Evans,
James R. Thompson,
2005
.
John L. Evans,
A. Tseng,
Jiawei Zhang,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).