Chris Ngai

发表

Towards manufacturing a 10nm node device with complementary EUV lithography

Jan V. Hermans, Huixiong Dai, Ardavan Niroomand, 2013, Advanced Lithography.

Double patterning combined with shrink technique to extend ArF lithography for contact holes to 22nm node and beyond

Hao Chen, Chris Ngai, Chris Bencher, 2008, SPIE Advanced Lithography.

EUV defect characterization study on post litho and etch for 1x and 2x node processes

Chris Ngai, Ofir Montal, Ido Dolev, 2011, Advanced Lithography.

Demonstration of 32nm half-pitch electrical testable NAND FLASH patterns using self-aligned double patterning

Ping Xu, Huixiong Dai, Chris Ngai, 2009, Advanced Lithography.

From simulation to characterization - integrated approach for Self Aligned Double Patterning defectivity

Chris Ngai, Doron Meshulach, Amiad Conley, 2008, 2008 International Symposium on Semiconductor Manufacturing (ISSM).

Model calibration and slit position effect on full-mask process and proximity correction for extreme ultraviolet lithography

Huixiong Dai, Chris Ngai, Xumou Xu, 2012, Advanced Lithography.

Implementing self-aligned double patterning on non-gridded design layouts

Huixiong Dai, Chris Ngai, Jason Sweis, 2009, Advanced Lithography.

Spatial frequency multiplication techniques towards half-pitch 10nm patterning

Ping Xu, Hao Chen, Chris Ngai, 2011, Advanced Lithography.

RET application in 45-nm node and 32-nm node contact hole dry ArF lithography process development

Chris Ngai, Christopher Dennis Bencher, Xiangqun Miao, 2007, SPIE Advanced Lithography.

Post-litho line edge/width roughness smoothing by ion implantations

Peng Xie, Huixiong Dai, Chris Ngai, 2013, Advanced Lithography.

Sidewall spacer quadruple patterning for 15nm half-pitch

Ping Xu, Chris Ngai, Yijian Chen, 2011, Advanced Lithography.

Wafer edge polishing process for defect reduction during immersion lithography

Chris Ngai, Abraham Anapolsky, Motoya Okazaki, 2008, SPIE Advanced Lithography.

Toward 22 nm: fast and effective intrafield monitoring and optimization of process windows and critical dimension uniformity

Jo Finders, Huixiong Dai, Chris Ngai, 2011 .

Plasma damage monitoring for PECVD deposition: a contact potential difference study and device yield analysis

Chris Ngai, Christopher Dennis Bencher, Zhiwei Xu, 1998, Advanced Lithography.

Accounting for mask topography effects in source-mask optimization for advanced nodes

Huixiong Dai, Chris Ngai, Hsu-Ting Huang, 2011, Advanced Lithography.

45nm and 32nm half-pitch patterning with 193nm dry lithography and double patterning

Huixiong Dai, Chris Ngai, Christopher Dennis Bencher, 2008, SPIE Advanced Lithography.

Challenges of 29nm half-pitch NAND Flash STI patterning with 193nm dry lithography and self-aligned double patterning

Chris Ngai, Benjamin Szu-Min Lin, Amiad Conley, 2008, Lithography Asia.

Recessive self-aligned double patterning with gap-fill technology

Hao Chen, Chris Ngai, Yijian Chen, 2011, Advanced Lithography.

Self-aligned triple patterning for continuous IC scaling to half-pitch 15nm

Ping Xu, Chris Ngai, Yijian Chen, 2011, Advanced Lithography.

Alignment and overlay improvements for 3x nm and beyond process with CVD sidewall spacer double patterning

Huixiong Dai, Chris Ngai, Christopher Dennis Bencher, 2009, Advanced Lithography.

Process and proximity correction, and verification for extreme ultraviolet lithography

Huixiong Dai, Chris Ngai, Xin Zheng, 2013, Advanced Lithography.

Metrology characterization for self-aligned double patterning

Huixiong Dai, Chris Ngai, James Yu, 2008, SPIE Advanced Lithography.

Understanding device impact of line edge/width roughness in frequency domain

Peng Xie, He Ren, Huixiong Dai, 2013, Advanced Lithography.

Free form source and mask optimization for negative tone resist development for 22nm node contact holes

Huixiong Dai, Chris Ngai, Grozdan Grozev, 2012, Advanced Lithography.

Impact of process decisions and alignment strategy on overlay for the 14nm node

Huixiong Dai, David Laidler, Yongmei Chen, 2013, Advanced Lithography.

Full-chip OPC and verification with a fast mask 3D model

Huixiong Dai, Chris Ngai, Hsu-Ting Huang, 2011, Advanced Lithography.

Small particle defect characterization on critical layers of 22nm Spacer Self-Aligned Double Patterning (SADP)

Chris Ngai, Saar Shabtay, Kfir Dotan, 2012, Advanced Lithography.

Tracking defectivity of EUV and SADP processing using bright-field inspection

Huixiong Dai, Chris Ngai, Kfir Dotan, 2014, Advanced Lithography.

Defect gallery and bump defect reduction in the self Aligned Double Patterning module

Chris Ngai, Cathy Cai, Deenesh Padhi, 2010, 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC).