Wen Qiu

Design of ultra-low sidelobe pulse compression filter for LFM signal

Peng Li, Renhong Xie, Yibin Rui, 2019, International Conference on Signal Processing Systems.

Joint code acquisition and Doppler shift estimation method for DSSS-MSK signal

Peng Li, Renhong Xie, Yibin Rui, 2019, International Conference on Signal Processing Systems.

High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages

Allen Gu, Wen Qiu, Syahirah Md Zulkifli, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Defect Z-depth Determination in Flip-chip using lock-in thermography

Brian Lai, Wen Qiu, Bemice Zee, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

2.5D Package Modelling for Short Circuit Failure Analysis by High-Resolution Time-domain Reflectometry

Yang Shang, Wen Qiu, Makoto Shinohara, 2018, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Recent advances in fault isolation for semiconductor industry

Vinod Narang, Wen Qiu, Joseph Tan, 2013, Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Lock-in Thermography for Flip-Chip Package Failure Analysis

Rudolf Schlangen, Kannu Wadhwa, Lihong Cao, 2012 .