Ryo Takigawa

1THz one-sided directional slot antenna on a chip connected with InAs HEMT

Tanemasa Asano, Haruichi Kanaya, Kazutoshi Kato, 2020, OPTO.

Low-temperature bonding of a LiNbO3 waveguide chip to a Si substrate in ambient air for hybrid-integrated optical devices

Eiji Higurashi, Satoshi Shinada, Tetsuya Kawanishi, 2006, SPIE Optics East.

Low-Temperature Au-to-Au Bonding for LiNbO3/Si Structure Achieved in Ambient Air

Tetsuya Kawanishi, Tadatomo Suga, Eiji Higurashi, 2007, IEICE Trans. Electron..

Low temperature bonding of LiNbO3 waveguide chips to Si substrates in air

Eiji Higurashi, Satoshi Shinada, Tetsuya Kawanishi, 2005, International Symposium on Optomechatronic Technologies.

Design example of SENS primary lining toward introduction of performance-based design

Takashi Nakayama, Ryo Takigawa, Kiwamu Tsuno, 2020 .

High-speed via hole filling using electrophoresis of Ag nanoparticles

Akihiro Ikeda, Tanemasa Asano, Ryo Takigawa, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Air-gap structure between integrated LiNbO3 optical modulators and micromachined Si substrates.

Tetsuya Kawanishi, Tadatomo Suga, Eiji Higurashi, 2011, Optics express.

Room-Temperature Bonding of Vertical-Cavity Surface-Emitting Laser Chips on Si Substrates Using Au Microbumps in Ambient Air

Tadatomo Suga, Renshi Sawada, Eiji Higurashi, 2008 .

Low-temperature bonding of laser diode chips on Si substrates with oxygen and hydrogen atmospheric-pressure plasma activation

Tadatomo Suga, Renshi Sawada, Eiji Higurashi, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Room-temperature hermetic sealing by ultrasonic bonding with Au compliant rim

Tanemasa Asano, Ryo Takigawa, Takanori Shuto, 2014 .