Steffen Wiese

发表

Jens Lienig, Sven Rzepka, Frank Kraemer, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Jens Lienig, Sven Rzepka, Steffen Wiese, 2010, 2010 12th Electronics Packaging Technology Conference.

Mike Roellig, Steffen Wiese, Klaus-Jürgen Wolter, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

Steffen Wiese, Frank Kraemer, Erik Peter, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Jens Lienig, Sven Rzepka, Frank Kraemer, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

Steffen Wiese, Klaus-Jürgen Wolter, K. Wolter, 2004, Microelectron. Reliab..

Bernd Michel, Rainer Dudek, Bernhard Wunderle, 2007, Microelectron. Reliab..

Steffen Wiese, Frank Kraemer, 2011, 18th European Microelectronics & Packaging Conference.

Klaus-Jurgen Wolter, Steffen Wiese, Rico Meier, 2010, Optics + Photonics for Sustainable Energy.

Steffen Wiese, Klaus-Jürgen Wolter, K. Wolter, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Rainer Dudek, Sven Rzepka, Steffen Wiese, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Sven Rzepka, Steffen Wiese, S. Rzepka, 2004, Microelectron. Reliab..

Steffen Wiese, F. Kraemer, Jonas Seib, 2012, EuroSimE 2012.

S. Rzepka, Steffen Wiese, E. Meusel, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Steffen Wiese, Rico Meier, Frank Kraemer, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

Steffen Wiese, E. Meusel, F. Feustel, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

S. Rzepka, Steffen Wiese, E. Meusel, 2002, 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617).

Steffen Wiese, S. Wiese, J. Al Ahmar, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).

Steffen Wiese, Rico Meier, Frank Kraemer, 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Jens Lienig, Sven Rzepka, Steffen Wiese, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Klaus-Jurgen Wolter, Steffen Wiese, E. Meusel, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..