Xi Zhang

发表

Self-Peeling of Porous Nickel Foam from the Electrochemically Etched Porous Silicon

K. Tu, Xi Zhang, 2005 .

Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition

Xi Zhang, King-Ning Tu, Kai Chen, 2007 .

Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins

Jianmin Miao, John H. L. Pang, Robert Preisser, 2007 .

Electromigration effect on strain and mechanical property change in lead-free solder joints

K. Tu, J. Pang, Luhua Xu, 2006, 2006 8th Electronics Packaging Technology Conference.

Characterization of Nano-grained High Aspect Ratio Through-wafer Copper Interconnect Column

K. Tu, J. Pang, Luhua Xu, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Study of Ni Metallization in Macroporous Si Using Wet Chemistry for Radio Frequency Cross-Talk Isolation in Mixed Signal Integrated Circuits

Yahong Xie, K. Tu, K. Chong, 2011, Materials.

High Aspect Ratio Nickel Structures Fabricated by Electrochemical Replication of Hydrofluoric Acid Etched Silicon

Yahong Xie, K. Tu, C. Tung, 2006 .

The metallic nickel inserted p/sup -//p/sup +/ Si substrate used for RF crosstalk reduction in mixed signal ICs

Yahong Xie, K. Tu, K. Chong, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

Preparation of hierarchically porous nickel from macroporous silicon.

K. Tu, Xi Zhang, 2006, Journal of the American Chemical Society.

Study of the initial stage of electroless Ni deposition on Si (100) substrates in aqueous alkaline solution

M. Goorsky, K. Tu, Xi Zhang, 2006 .

Erratum: “Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition” [Appl. Phys. Lett.91, 254105 (2007)]

Vidvuds Ozolins, Xi Zhang, King-Ning Tu, 2010 .

In-situ study of the effect of electromigration on strain evolution and mechanical property change in lead-free solder joints

K. Tu, J. Pang, Luhua Xu, 2006, 56th Electronic Components and Technology Conference 2006.

Immersion nickel deposition on blank silicon in aqueous solution containing ammonium fluoride

K. Tu, Zhong Chen, Xi Zhang, 2007 .