Matthias Klein

Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality

Florian Solzbacher, Reid R. Harrison, Richard A. Normann, 2011 .

Flip-chip assembly and reliability using gold/tin solder bumps

Herbert Reichl, Matthias Klein, Matthias Hutter, 2004, SPIE Photonics Europe.

Packaging concepts for neuroprosthetic implants

Herbert Reichl, Florian Solzbacher, Prashant Tathireddy, 2007 .

3D Integration of MEMS and IC: Design, Technology and Simulations

Josef Prainsack, Sven Reitz, Josef Weber, 2010 .

Nanoporous interconnects

Bernhard Wunderle, Matthias Klein, Lothar Dietrich, 2010, 3rd Electronics System Integration Technology Conference ESTC.

A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level

Hannu Kattelus, Matthias Klein, Michael Topper, 2009, 2009 European Microelectronics and Packaging Conference.

Low cost wafer-level 3-D integration without TSV

Herbert Reichl, Thomas Fritzsch, Matthias Klein, 2009, 2009 59th Electronic Components and Technology Conference.

Miniaturised Sensor Node for Tire Pressure Monitoring (e-CUBES)

Markus Dielacher, Josef Prainsack, Peter Ramm, 2009 .