Ingrid De Wolf

发表

Behavior of RF MEMS switches under ESD stress

Dimitri Linten, Sandeep Sangameswaran, Jeroen De Coster, 2010, Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2010.

Fabrication and reliability testing of Ti/TiN heaters

Ingrid De Wolf, Piet De Moor, Ann Witvrouw, 1999, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.

The reliability of RF-MEMS: failure modes, test procedures, and instrumentation

Ingrid De Wolf, 2003, SPIE MOEMS-MEMS.

Nano-scale resonant sensors for gas and bio detection: Expectations and challenges

Adrian M. Ionescu, Vladimir Cherman, Ingrid De Wolf, 2009, 2009 International Semiconductor Conference.

High-speed 3D optical imaging and failure analysis of high- and low-frequency movements in micro-electro-mechanical (MEMS) with nanometer resolution

Ingrid De Wolf, Bob Puers, W. Merlijn van Spengen, 2001, SPIE MOEMS-MEMS.

Micro nano technology visualization (MNTV) of micromachined MEMS polysilicon structures

Ingrid De Wolf, Leslie M. Phinney, Russell A. Lawton, 2000, SPIE MOEMS-MEMS.

Experimental one- and two-dimensional mechanical stress characterization of silicon microsystems using micro-Raman spectroscopy

Ingrid De Wolf, Roy Knechtel, W. Merlijn van Spengen, 2000, SPIE MOEMS-MEMS.

Numerical analysis of the process-induced stresses in silicon microstructures

Ingrid De Wolf, Thomas Hoffmann, Vincent Senez, 2004, SPIE Micro + Nano Materials, Devices, and Applications.

Characterization of (near) hermetic zero-level packages for MEMS

Anne Jourdain, Ingrid De Wolf, Piet De Moor, 2005, SPIE MOEMS-MEMS.

3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications

Eric Beyne, Martine Baelmans, Ingrid De Wolf, 2015, 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).

Convolution-Based Fast Thermal Model for 3-D-ICs: Transient Experimental Validation

Eric Beyne, Martine Baelmans, Vladimir Cherman, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Auto-adhesion model for MEMS surfaces taking into account the effect of surface roughness

Ingrid De Wolf, Bob Puers, W. Merlijn van Spengen, 2000, SPIE MOEMS-MEMS.

Performance of a new type of module based on back-contact solar cells

Ingrid De Wolf, Jan Vanfleteren, Mario Gonzalez, 2010, Optics + Photonics for Sustainable Energy.

High-resolution stress and temperature measurements in semiconductor devices using micro-Raman spectroscopy

Ingrid De Wolf, Mahmoud Rasras, Veerle Simons, 1999, International Symposium on Photonics and Applications.

Distributed electro-thermal model based on fast and scalable algorithm for GaN power devices and circuit simulations

Martine Baelmans, Ingrid De Wolf, Stefaan Decoutere, 2017, 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD).

Raman spectroscopy measurement of local stress induced by LOCOS and trench structures in the silicon substrate

Ingrid De Wolf, Kevin Yallup, Herman E. Maes, 1993, ESSDERC '93: 23rd European solid State Device Research Conference.

New methods and instrumentation for functional, yield and reliability testing of MEMS on device, chip and wafer level

Sandeep Sangameswaran, Jeroen De Coster, Vladimir Cherman, 2009, Microtechnologies.

Fast Transient Convolution-Based Thermal Modeling Methodology for Including the Package Thermal Impact in 3D ICs

Eric Beyne, Martine Baelmans, Ingrid De Wolf, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Influence of the processing method on the amount and development of voids in miniaturized interconnections

Ingrid De Wolf, Riet Labie, Bert Verlinden, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Impact of Cu TSVs on BEOL metal and dielectric reliability

Eric Beyne, Anne Jourdain, Ingrid De Wolf, 2014, 2014 IEEE International Reliability Physics Symposium.

On the physics of stiction and its impact on the reliability of microstructures

Robert Puers, Ingrid De Wolf, I. De Wolf, 2003 .

A study of breakdown mechanisms in electrostatic actuators using mechanical response under EOS-ESD stress

Mirko Scholz, Dimitri Linten, Sandeep Sangameswaran, 2009, 2009 31st EOS/ESD Symposium.

Characterization and failure analysis of MEMS: high resolution optical investigation of small out-of-plane movements and fast vibrations

Ingrid De Wolf, R. Puers, R. Mertens, 2004 .

Impact of Via Density on the Mechanical Integrity of Advanced Back-End-of-Line During Packaging

Eric Beyne, Ingrid De Wolf, Mario Gonzalez, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Expected Failures in 3-D Technology and Related Failure Analysis Challenges

Eric Beyne, Ingrid De Wolf, Kristof Croes, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Thermo-mechanical challenges of advanced solar cell modules

Ingrid De Wolf, Mario Gonzalez, Riet Labie, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Convolution based compact thermal model for 3D-ICs: Methodology and accuracy analysis

Eric Beyne, Ingrid De Wolf, Herman Oprins, 2013, 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

Fine Pitch Rapid Heat Self-Aligned Assembly and Liquid-Mediated Direct Bonding of Si Chips

Eric Beyne, Jean-Pierre Celis, Ingrid De Wolf, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Defect detection in Through Silicon Vias by GHz Scanning Acoustic Microscopy: Key ultrasonic characteristics

Eric Beyne, Ingrid De Wolf, Herbert Struyf, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

High frequency scanning acoustic microscopy applied to 3D integrated process: Void detection in Through Silicon Vias

Eric Beyne, Sandip Halder, Ingrid De Wolf, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Design aspects for CPI robust BEOL

Bart Vandevelde, Ingrid De Wolf, Mario Gonzalez, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

A modeling and experimental method for accurate thermal analysis of AlGaN/GaN powerbars

Martine Baelmans, Ingrid De Wolf, Stefaan Decoutere, 2015, 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD).