Qian Wang

发表

Reactive ion etching of poly (cyclohexene carbonate) in oxygen plasma

Zheyao Wang, Jian Cai, K. Zhou, 2018 .

Indium-based Flip-chip Interconnection for Superconducting Quantum Computing Application

Jian Cai, Shengjuan Zhou, Qian Wang, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Experimental and computational investigation of low temperature Cu Sn solid-state-diffusion bonding for 3D integration

Junqiang Wang, Jian Cai, Qian Wang, 2021 .

Effects of Current Stress for Low Temperature Cu/Sn/Cu Solid-State-Diffusion Bonding

Junqiang Wang, Q. Wang, Jian Cai, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Plasma combined self-assembled monolayer pretreatment on electroplated-Cu surface for low temperature Cu–Sn bonding in 3D integration

Junqiang Wang, Jian Cai, Zijian Wu, 2017 .

Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

Hongda Du, Q. Wang, Liangliang Li, 2014 .

Effect of nano-Al2O3 reinforcement on the microstructure and reliability of Sn-3.0Ag-0.5Cu solder joints

Jian Cai, Lei Liu, Qian Wang, 2016, Microelectron. Reliab..

Surface activated bonding method applied in MEMS pressure sensor with TSV structures

T. Suga, Jian Cai, Yinghui Wang, 2014, 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).

Study of viscoelastic effect of EMC on FBGA block warpage by FEA simulation

Q. Wang, Shuidi Wang, Jian Cai, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Dependence of shear strength of Sn–3.8Ag–0.7Cu/Co–P solder joints on the P content of Co–P metallization

Liangliang Li, Shuang Liu, Yang Hu, 2019, Journal of Materials Science: Materials in Electronics.

Significantly enhanced shear strength of Sn-Ag-Cu/Co-P ball grid array solder joints by CoSn3 intermetallic compound

Liangliang Li, Jian Cai, Donghua Yang, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

Kinetics of interfacial reaction between Sn-3.0Ag-0.5Cu solder and Co-4.0P or Co-8.0P metallization

Q. Wang, Liangliang Li, Jian Cai, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

IMC growth and shear strength of Sn–Ag–Cu/Co–P ball grid array solder joints under thermal cycling

Liangliang Li, Jian Cai, Donghua Yang, 2015, Journal of Materials Science: Materials in Electronics.

Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil Printing

Jian Cai, Ziyu Liu, Xi He, 2014, Journal of Electronic Materials.

Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness

Qian Wang, Jian Cai, Junqiang Wang, 2017, Journal of Electronic Materials.

Investigation on FBGA block warpage by Finite Element Simulation

Q. Wang, Shuidi Wang, Jian Cai, 2012 .

Performance and reliability study of Pd-coated copper wire bonding on ENEPIG substrate

Shuidi Wang, Jian Cai, Jingwei Li, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Low Temperature Fine-pitch Cu-Cu Bonding Using Au Nanoparticles as Intermediate

Jian Cai, Qian Wang, Jun-Peng Fang, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

Development of Hybrid Bonding Process for Embedded Bump with Cu-Sn/BCB Structure

Jian Cai, Yang Hu, Huang Chen, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

Thermal-stable void-free interface morphology and bonding mechanism of low-temperature Cu-Cu bonding using Ag nanostructure as intermediate

Zheyao Wang, G. Zou, Jian Cai, 2018, Journal of Alloys and Compounds.

Modified pulse laser deposition of Ag nanostructure as intermediate for low temperature Cu-Cu bonding

G. Zou, Jian Cai, Ziyu Liu, 2018, Applied Surface Science.

Low Temperature Cu-Cu Bonding Using Ag Nanostructure for 3D Integration

Jian Cai, Yang Hu, Ziyu Liu, 2015 .

Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection

Junqiang Wang, Jian Cai, Q. Wang, 2016 .

Low temperature Cu-Cu bonding using copper nanoparticles fabricated by high pressure PVD

Junqiang Wang, Jian Cai, Q. Wang, 2017 .

Study on Ar(5%H2) Plasma Pretreatment for Cu/Sn/Cu Solid-State-Diffusion Bonding in 3D Interconnection

Junqiang Wang, Q. Wang, Jian Cai, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Low Temperature Au-Au Bonding Using Ag Nanoparticles as Intermediate for Die Attachment in Power Device Packaging

Jian Cai, Z. Geng, J. Fang, 2022, Applied Surface Science.

Low temperature Cu-Cu bonding using Ag nanoparticles by PVD

Jian Cai, Ziyu Liu, Zijian Wu, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition

Junqiang Wang, Q. Wang, Jian Cai, 2018, Journal of Electronic Materials.

Detection and formation mechanism of micro-defects in ultrafine pitch Cu—Cu direct bonding*

Qian Wang, Jian Cai, Yu Chen, 2016 .

Properties and morphology of TiN films deposited by atomic layer deposition

Jian Cai, Ziyu Liu, Lu Wang, 2014, Tsinghua Science and Technology.

Low Temperature Fine-Pitch Wafer-Level Cu-Cu Bonding Using Nanoparticles Fabricated by PVD

Q. Wang, Jian Cai, Changmin Song, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Design and Simulation of Deep Trench Capacitor on High-Performance Silicon Interposer

Jian Cai, Changmin Song, Qian Wang, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Characterization of after-reflow misalignment on Head-in-Pillow defect in BGA assembly

Jian Cai, Guisheng Zou, Zhengyu Zhao, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Performance and reliability study of TGV interposer in 3D integration

Q. Wang, Jian Cai, Tiwei Wei, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration

Junqiang Wang, Jian Cai, Zijian Wu, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Electroplating Cu on ALD TiN for high aspect ratio TSV

Q. Wang, Wenqi Zhang, Jian Cai, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Low temperature Cu-Cu bonding using tin nanoparticles fabricated by high pressure magnetron sputtering

Jian Cai, Zijian Wu, Qian Wang, 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).

Microstructure of AuSn Wafer Bonding for RF-MEMS Packaging

Jian Cai, Woonbae Kim, Qian Wang, 2005, 2005 6th International Conference on Electronic Packaging Technology.

Ultra-thin chip on flex by Solder-on-Pad (SoP) technology

Fengwei Wang, Jian Cai, C. Q. Cui, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Interfacial morphology and grain orientation during bumpless direct Cu bonding

Qian Wang, Jian Cai, Jian Cai, 2015 .

Characterization of stencil printing parameters for fine pitch wafer bumping

Q. Wang, Jian Cai, Ziyu Liu, 2014, 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy.

Characterization of stencil printing parameters for fine pitch wafer bumping

Qian Wang, Jian Cai, Ziyu Liu, 2014, 2014 15th International Conference on Electronic Packaging Technology.