Ilyas Mohammed

Design and reliability study of lead bonding process in wave packages

Ilyas Mohammed, Young-Gon Kim, Teck-Gyu Kang, 2001 .

ADVANCED SIMULATION/MODELING AND RELIABILITY OF FINE PITCH (130um) LEAD- FREE FLIP-CHIP PACKAGE

Ilyas Mohammed, Bahareh Banijamali, B. Banijamali, 2008 .

Fine Pitch Copper Interconnects for Next Generation Package-on-Package (PoP)

Ilyas Mohammed, 2012 .

Design and reliability study of wire-bonded μBGA®packages for high performance DRAM applications

Sridhar Krishnan, Ilyas Mohammed, Young-Gon Kim, 2001 .

Reliability of fine-pitch flip-chip packages

Ilyas Mohammed, Bahareh Banijamali, B. Banijamali, 2009, 2009 59th Electronic Components and Technology Conference.

COHESIVE ZONE MODELING OF CRACK NUCLEATION AT BIMATERIAL CORNERS

Kenneth M. Liechti, Ilyas Mohammed, I. Mohammed, 2000 .

Package-on-package with very fine pitch interconnects for high bandwidth

Ilyas Mohammed, Rajesh Katkar, I. Mohammed, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Analysis of flip-chip packages using high resolution moire interferometry

Paul S. Ho, Ilyas Mohammed, Xiang Dai, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Quantitative strain analysis of flip-chip electronic packages using phase-shifting moiré interferometry

Paul S. Ho, Ilyas Mohammed, P. Ho, 2001 .

A design and performance study of 3D packaging for high performance memory applications

Ilyas Mohammed, Byong-Su Seol, S. Krishnan, 2003, IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003..

Study of thermal deformation in underfilled flip-chip packages using high-resolution Moire interferometry

Paul S. Ho, Ilyas Mohammed, Xiang Dai, 1999 .