Georg Meyer-Berg

High throughput and fine pitch Cu-Cu interconnection technology for multichip chip-last embedding

Rao Tummala, Venky Sundaram, Abhishek Choudhury, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

X-IGA: Consumer price packaging for 40Gbit/s transceiver modules?

Harry Hedler, Georg Meyer-Berg, Ivo Koren, 2003 .

Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF

Venky Sundaram, Abhishek Choudhury, Rao R. Tummala, 2009, 2009 59th Electronic Components and Technology Conference.

Low cost, chip-last embedded ICs in thin organic cores

Rao Tummala, Fuhan Liu, Venky Sundaram, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).