Wei-Jie Hung

Comparison of various low dielectric constant materials

G. S. Chen, J. Fang, Giin-Shan Chen, 2016, Thin Solid Films.

Electrical and reliability characteristics of dielectric stack with low dielectric constant SiCOH and capping SiCNH films

J. Fang, G. S. Chen, Giin-Shan Chen, 2018, Surface and Coatings Technology.

Effect of H2/He plasma treatment on porous low dielectric constant materials

Wen-Shi Lee, Y. L. Cheng, Wei-Jie Hung, 2016 .

Barrier-free process for fluorinated silicon glass film in Cu interconnects

G. S. Chen, J. Fang, Giin-Shan Chen, 2019, Thin Solid Films.