M. Kato

Robust Low-k Diffusion Barrier (k=3.5) for 45-nm Node Low-k (k=2.3)/Cu Integration

S. Nakao, S. Kaneko, K. Matsushita, 2006, 2006 International Interconnect Technology Conference.

UV/EB Cure Mechanism for Porous PECVD/SOD Low-k SiCOH Materials

S. Kondo, J. Ushio, T. Hamada, 2006, 2006 International Interconnect Technology Conference.

Dry-Developable Electron-Beam Resist -Synthesis and Resist Characteristic Evaluation of Amino-ended Poly(a-Methylstyrene)-

Y. Nagasaki, H. Aoki, M. Kato, 2006 .